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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: AM27S37A BUA
Alternate P/N: AM27S37ABUA
NSN : 5962-01-472-1949
NIIN : 014721949
CAGE Code : 34335
Manufacturer: Advanced Micro Devices Inc
Item Name : Microcircuit Memory
Thank you for your interest in our available parts and components on NSN Target. Microcircuit Memory is an item listed with the part number AM27S37A BUA, and it is manufactured by Advanced Micro Devices Inc. This particular item AM27S37A BUA is currently available for purchase through our website today, and our team of industry experts are on standby 24/7x365 to provide rapid lead-times and competitive pricing. To begin the purchasing process, we invite you to fill out and submit an Instant RFQ form as provided through our website. Once received, a member of our staff will reach out to you in 15 minutes or less to provide a quote that has been personalized to fit your individual needs.
NSN Parts is a website that is owned and operated by ASAP Semiconductor, and we serve as a leading independent distributor of NSN parts and components that serve many industries and applications. Throughout our extensive part and manufacturer catalogues, we carry a variety of top requested components that you may need, including AM27S37A BUA with NSN 5962014721949 and other parts manufactured by Advanced Micro Devices Inc. Quality is of the utmost importance to us at NSN Parts, and we have established ourselves as an FAA AC 00-56B, AS9120B, and ISO 9001:2015 certified enterprise. Get started today with a personalized quote and experience how we are revolutionizing the parts procurement process.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-472-1949 Item Description: Microcircuit Memory | 5962 | 014721949 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Am27s37a Bua | 5 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZER | Memory Device Type | PROM |
| CQSJ | Inclosure Material | CERAMIC |
| TTQY | Terminal Type And Quantity | 32 LEADLESS |
| CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
| CXCY | Part Name Assigned By Controlling Agency | 8,192-BIT (1024X8 BIPOLAR REGISTERED PROM WITH PROGRAMMABLE INITIALIZE INPUT |
| CBBL | Features Provided | SYNCHRONOUS AND 3-STATE OUTPUT AND LOW POWER AND W/SWITCH |
| AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
| MRC | Decoded Requirement | Clear Text Reply |
| FEAT | Special Features | 40 NS SETUP TIME/25 NS CLOCK-TO-OUTPUT |
| AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AGAV | End Item Identification | F-15 |
| CQWX | Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
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